Inductively Coupled Plasma (ICP) Etching Systems
Samco delivers many dedicated Inductively Coupled Plasma (ICP) etching system in research and production to meet each customer's process requirements for high-density plasma etching. Our reliable, durable and compact ICP etching system allows you to handle a variety of materials (III-V compound semiconductors (GaN, GaAs, InP), silicon, SiC, quartz, glass, dielectrics, and metals.).
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感應耦合式電漿蝕刻(ICP)系統RIE-400iP
饋刻氮化鎵(GaN), 砷化鎵(GaAs), 磷化銦(InP) & 碳化矽(SiC)
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感應耦合式(ICP-RIE)電漿蝕刻系統RIE-400iPC
不占空間的量產型系統
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感應耦合式(ICP-RIE)電漿蝕刻系統RIE-230iP
多方位loadlock系統
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感應耦合式(ICP-RIE)電漿蝕刻系統RIE-230iPC
多方位真空晶圓裝卸(cassette)系統
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感應耦合式(ICP-RIE)電漿蝕刻系統RIE-802iPC
雙腔體系統
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感應耦合式(ICP-RIE)電漿蝕刻系統RIE-800iPC
極佳的重複性及穏定性
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感應耦合式(ICP-RIE)電漿蝕刻系統RIE-350iPC
載盤(Tray)方式的製程
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感應耦合式(ICP-RIE)電漿蝕刻系統RIE-800iP
極佳的重複性及穏定性
Si Deep Reactive Ion Etching (DRIE) Systems
Samco delivers Silicon Deep Reactive Ion Etching (DRIE) systems for MEMS device fabrication and TSV via-hole etching. Samco was the first Japanese semiconductor process equipment manufacturer to provide DRIE systems using the Bosch Process. Our systems have industry-leading process capabilities, and the product lineup covers both R&D and production. For high-volume device manufacturing, a double reaction chamber specification is also available.
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矽深蝕刻設備RIE-400iPB
研發用途型蝕刻設備
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矽深蝕刻設備 RIE-800iPB
最大可對應ø8"晶圓
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矽深蝕刻系統 RIE-800BCT
可配置2個晶圓裝卸腔體的生產型設備
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矽深蝕刻系統 RIE-802BCT
雙反應腔體生產型設備
Reactive Ion Etching (RIE) - Plasma Etching Systems
Samco offers reliable and durable Reactive Ion Etching (RIE) Systems for R&D and production customers. Benchtop compact RIE etcher is a suitable tool for academic device research and die deprocessing for IC failure analysis. Open-load RIE systems and loadlock RIE systems have wide process window for plasma etching of various materials (silicon, dielectric, compound semiconductor, metal, polymer and photoresist). Cassette loading RIE systems improve process throughput for device fabrication.
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反應離子(RIE)蝕刻系統RIE-10NR
新穎小體積低價系統
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反應離子(RIE)蝕刻系統 RIE-200NL
極佳的再現性
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晶圓裝卸式(Cassette Loading)反應離子(RIE)蝕刻系統 RIE-200C
高產量系統
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ø300 mm 反應離子(RIE)蝕刻系統 RIE-300NR
晶圓尺寸可達ø300 mm (12吋)
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精簡蝕刻機 RIE-1C
精小簡易桌上型系統
Xenon Difluoride Etching Systems
Samco's Xenon difluoride (XeF2) Etching Systems is mainly using for the etching of the Si sacrificial layer for fabrication of MEMS (Micro Electro Mechanical Systems) devices. This dry process avoids the destruction of devices due to stiction, which is a problem in the wet process, and eliminates the need for pretreatment and post-processing in the wet process. It is also a tabletop type and very compact in design.
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矽材犧牲層蝕刻系統 VPE-4F
精簡桌上型系統