Inductively Coupled Plasma (ICP) Etching Systems

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Samco delivers many dedicated Inductively Coupled Plasma (ICP) etching system in research and production to meet each customer's process requirements for high-density plasma etching. Our reliable, durable and compact ICP etching system allows you to handle a variety of materials (III-V compound semiconductors (GaN, GaAs, InP), silicon, SiC, quartz, glass, dielectrics, and metals.).

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Si Deep Reactive Ion Etching (DRIE) Systems

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Samco delivers Silicon Deep Reactive Ion Etching (DRIE) systems for MEMS device fabrication and TSV via-hole etching. Samco was the first Japanese semiconductor process equipment manufacturer to provide DRIE systems using the Bosch Process. Our systems have industry-leading process capabilities, and the product lineup covers both R&D and production. For high-volume device manufacturing, a double reaction chamber specification is also available.

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Reactive Ion Etching (RIE) - Plasma Etching Systems

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Samco offers reliable and durable Reactive Ion Etching (RIE) Systems for R&D and production customers. Benchtop compact RIE etcher is a suitable tool for academic device research and die deprocessing for IC failure analysis. Open-load RIE systems and loadlock RIE systems have wide process window for plasma etching of various materials (silicon, dielectric, compound semiconductor, metal, polymer and photoresist). Cassette loading RIE systems improve process throughput for device fabrication.

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Xenon Difluoride Etching Systems

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Samco's Xenon difluoride (XeF2) Etching Systems is mainly using for the etching of the Si sacrificial layer for fabrication of MEMS (Micro Electro Mechanical Systems) devices. This dry process avoids the destruction of devices due to stiction, which is a problem in the wet process, and eliminates the need for pretreatment and post-processing in the wet process. It is also a tabletop type and very compact in design.

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