ProductsEtching

Samco delivers many dedicated Inductively Coupled Plasma (ICP) etching system in research and production to meet each customer's process requirements for high-density plasma etching. Our reliable, durable and compact ICP etching system allows you to handle a variety of materials (III-V compound semiconductors (GaN, GaAs, InP), silicon, SiC, quartz, glass, dielectrics, and metals.).

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  ICP-RIE Plasma Etching System RIE-400iP

  for GaN, GaAs, InP, & SiC
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  ICP-RIE Plasma Etching System RIE-400iPC

  Space-saving production system

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  ICP-RIE Plasma Etching System RIE-230iP

  Versatile loadlock system

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  ICP-RIE Plasma Etching System RIE-230iPC

  Versatile vacuum cassette system

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  ICP-RIE Plasma Etching System RIE-802iPC

  Double chamber system

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  ICP-RIE Plasma Etching System RIE-800iPC

  Excellent repeatability & stability

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  ICP-RIE Plasma Etching System RIE-350iPC

  Tray based batch processing

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  ICP-RIE Plasma Etching System RIE-800iP

  Excellent repeatability & stability

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Samco delivers Silicon Deep Reactive Ion Etching (DRIE) systems for MEMS device fabrication and TSV via-hole etching. Samco was the first Japanese semiconductor process equipment manufacturer to provide DRIE systems using the Bosch Process. Our systems have industry-leading process capabilities, and the product lineup covers both R&D and production. For high-volume device manufacturing, a double reaction chamber specification is also available.

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  矽深蝕刻系統 RIE-400iPB

  開發研究專用經濟版系統

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  矽深蝕刻系統 RIE-800iPB

  領先世界的性能

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  矽深蝕刻系統 RIE-800iPBC

  真空晶圓盒承載用
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  矽深蝕刻系統 RIE-800BCT

  大氣晶圓盒承載用

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  矽深蝕刻系統 RIE-802BCT

  雙腔體系統

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Samco offers reliable and durable Reactive Ion Etching (RIE) Systems for R&D and production customers. Benchtop compact RIE etcher is a suitable tool for academic device research and die deprocessing for IC failure analysis. Open-load RIE systems and loadlock RIE systems have wide process window for plasma etching of various materials (silicon, dielectric, compound semiconductor, metal, polymer and photoresist). Cassette loading RIE systems improve process throughput for device fabrication.

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  RIE Plasma Etching System RIE-10NR

  Compact novel low-cost system

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  RIE Plasma Etching System RIE-200NL

  Excellent repeatability

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  Cassette Loading RIE Plasma Etching System RIE-200C

  High throughput system

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  ø300 mm RIE Plasma Etching System RIE-300NR

  Up to ø300 mm (12")

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  Compact Etcher RIE-1C

  Compact benchtop system

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Samco's Xenon difluoride (XeF2) Etching Systems is mainly using for the etching of the Si sacrificial layer for fabrication of MEMS (Micro Electro Mechanical Systems) devices. This dry process avoids the destruction of devices due to stiction, which is a problem in the wet process, and eliminates the need for pretreatment and post-processing in the wet process. It is also a tabletop type and very compact in design.

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  Si Sacrificial Layer Etching System VPE-4F

  Compact benchtop system

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