Plasma Enhanced CVD Systems
Plasma Enhanced Chemical Vapor Deposition (PECVD) is a technology to form a thin film by generating active radicals and ions on a target substrate by turning a reactive gas into a plasma state and causing a chemical reaction on the target substrate to be deposited. It is used to deposit silicon nitride film (SiN) as a passivation film and silicon oxide film (SiO₂) as an interlayer insulating film in the manufacturing process of compound semiconductors and silicon semiconductors.
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電漿增強化學氣相沉積(CVD)系統 PD-220NL
適合R&D的小體積Loadlock系統
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電漿增強化學氣相沉積(CVD)系統 PD-2201LC
省空間的量產系統
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電漿增強化學氣相沉積(CVD)系統PD-3800L
Tray承載盤為主的批次處理製程