Tech News

3 October 2025

Atomic-Level Etch Control - Introduction to Atomic Layer Etching (ALE) Systems

2 July 2025

Simultaneous Double-sided Wafer Deposition via Plasma Enhanced ALD

4 April 2025

Introduction of the Single-Wafer Aqua Plasma® System

20 January 2025

Introduction to the 700°C High-Temperature PECVD System PD-101TC

27 December 2024

ICP Etching Process for Realizing SiC Trench MOSFETs

7 October 2024

Surface Treatment of Gold Using Aqua Plasma®

16 September 2024

Introduction to the Long-Term Process Stability of Samco Plasma CVD "PD-220 Series" Systems

26 July 2024

Innovation with the New Plasma Source HSTC-M™

1 March 2024

New Approach for Trench-Type SiC MOSFET

20 February 2024

Introduction of the Three-Chamber CVD System "PD-2203LC"

26 January 2024

Introduction of Plasma Scribing Technology on GaAs Wafers Using ICP Etching

30 July 2023

Device Isolation Processing of GaN on Si Power Devices

28 April 2023

Aqua Plasma Boost, Reducing Large Sized Samples of Oxidized Copper

28 February 2023

Aqua Plasma Supports Reduction of Oxidized Copper@AEI November 2022

23 September 2022

The Anode/Cathode Electrode Switching Function of PECVD System PD-200STL

30 July 2022

Plasma Enhanced & Thermal ALD System AD-800LP

29 July 2021

60 MHz VHF-PECVD for SN-2-SiNx and Microcrystalline Si Film

12 July 2021

Loading Effect and Microloading Effect in Si Deep Reactive Ion Etching

24 April 2021

Next-generation GaAs VCSEL Plasma Etch Process Technology

22 January 2021

Equipment Advances for the Bosch Process

2 December 2020

What is the Bosch Process (Deep Reactive Ion Etching)?

6 October 2020

Introduction to Si-DRIE (Silicon Deep Reactive Ion Etching)

1 September 2020

High Performance In-situ Monitoring System for ICP Dry Etching

25 August 2020

Stress Control in Dual-frequency Plasma-Enhanced Chemical Vapor Deposition (PECVD)

31 July 2020

GaN Trench Etching and Sidewall Angle Control for Vertical Power Devices

15 May 2020

GaN Etching for MiniLED and MicroLED Applications

14 May 2020

New Etching and Deposition Approach for Trench Type SiC MOSFETs

1 April 2017

Scallop Free Positive Tapered Si Via Etch Using SF6-O2 Non-Bosch DRIE

1 May 2016

Improvement of LED Luminance Efficiency by Sapphire Nano PSS Etching

1 April 2016

Atomic Layer Deposition (ALD) System for Power Device Applications

10 October 2015

TEOS-SiO₂ Chemical Vapor Deposition for Electronic Components

18 May 2015

Optimizing the SiC Plasma Etching Process for Manufacturing Power Devices

1 April 2015

SiNx PECVD Technology without Using Explosive SiH4 Gas

10 October 2014

Plasma Dicing Solutions of a Variety of Materials

1 July 2014

RIE-800iPBC Si DRIE System for MEMS Devices Manufacturing

10 October 2013

Deposition of SiOCH Films Suitable for MEMS Manufacturing

1 July 2013

The Bosch Process Data Low-scallop Etching Process and Sidewall Smoothing Process

1 May 2013

Chlorine-Based ICP Etching for Improving the Luminance Efficiency in Nitride LEDs

10 October 2012

Plasma Dicing and Scribing Technology for GaAs Based Devices

1 July 2012

RIE-400iPB System High-Speed, Deep Silicon Etching for R&D

1 April 2012

SiO2 and SiN etching by Low Global Warming Potential Gas

10 October 2011

High-speed Etching of SiO₂ and SiC

10 October 2010

Deep Etching of Compound Semiconductors (GaAs)