Atomic Layer Deposition Systems

Find out more

Atomic Layer Deposition (ALD) is a technology to deposite thin films in atomic scale, and it uses chemical reaction between sample surfaces and precursors in sequential pulsing. Compared to conventional PECVD technology, conformal thin film coating can be achieved on trench and via hole structures in high aspect ratio.

Find out more

Plasma Enhanced CVD Systems

Find out more

Plasma Enhanced Chemical Vapor Deposition (PECVD) is a technology to form a thin film by generating active radicals and ions on a target substrate by turning a reactive gas into a plasma state and causing a chemical reaction on the target substrate to be deposited. It is used to deposit silicon nitride film (SiN) as a passivation film and silicon oxide film (SiO₂) as an interlayer insulating film in the manufacturing process of compound semiconductors and silicon semiconductors.

Find out more

Liquid Source CVD Systems

Find out more

The Liquid Source CVD Systems is a low-temperature (80 ~ 400°C), high-rate (>300 nm/min) plasma enhanced CVD system for R&D. Samco's unique LSCVD system uses self-bias deposition techniques and a TEOS to deposit SiO2 films with low stress, from thin films to extremely thick films (up to 100 µm).

Find out more

Diamond-Like Carbon Coating Systems

Find out more

Diamond-like carbon (DLC) coating is a process of depositing a DLC film on a substrate by plasma enhanced chemical vapor deposition (CVD). Samco's DLC coating process allows the formation of dense films using high ion energy. This film has a high barrier performance.

Find out more