Atomic Layer Deposition (ALD) is a technology to deposite thin films in atomic scale, and it uses chemical reaction between sample surfaces and precursors in sequential pulsing. Compared to conventional PECVD technology, conformal thin film coating can be achieved on trench and via hole structures in high aspect ratio.
Plasma Enhanced ALD System AD-230LP
Excellent repeatability & stability
Thermal ALD System AL-1
Pin-hole free films deposition
Plasma Enhanced Chemical Vapor Deposition (PECVD) is a technology to form a thin film by generating active radicals and ions on a target substrate by turning a reactive gas into a plasma state and causing a chemical reaction on the target substrate to be deposited. It is used to deposit silicon nitride film (SiN) as a passivation film and silicon oxide film (SiO₂) as an interlayer insulating film in the manufacturing process of compound semiconductors and silicon semiconductors.
Plasma Enhanced CVD System PD-220NL
Compact loadlock system for R&D
Plasma Enhanced CVD System PD-2201LC
Space-saving production system
Plasma Enhanced CVD System PD-3800L
Tray based batch processing
The Liquid Source CVD Systems is a low-temperature (80 ~ 400°C), high-rate (>300 nm/min) plasma enhanced CVD system for R&D. Samco's unique LSCVD system uses self-bias deposition techniques and a TEOS to deposit SiO2 films with low stress, from thin films to extremely thick films (up to 100 µm).
Liquid Source CVD System PD-200STL
Loadlock system up to ø200 mm
Liquid Source CVD System PD-270STLC
Cassette loading system
Liquid Source CVD System PD-330STC
Processing up to ø300 mm
Liquid Source CVD System PD-100ST
Open-load system for R&D
Diamond-like carbon (DLC) coating is a process of depositing a DLC film on a substrate by plasma enhanced chemical vapor deposition (CVD). Samco's DLC coating process allows the formation of dense films using high ion energy. This film has a high barrier performance.
Diamond-Like Carbon Coating System PD-100D
Dedicated for DLC Coating