Tech News

22 January 2021

Equipment Advances for the Bosch Process

2 December 2020

What is the Bosch Process (Deep Reactive Ion Etching)?

6 October 2020

Introduction to Si-DRIE (Silicon Deep Reactive Ion Etching)

1 September 2020

High Performance In-situ Monitoring System for ICP Dry Etching

25 August 2020

Stress Control in Dual-frequency Plasma-Enhanced Chemical Vapor Deposition (PECVD)

15 May 2020

GaN Etching for MiniLED and MicroLED Applications

14 May 2020

New Etching and Deposition Approach for Trench Type SiC MOSFETs

1 April 2017

Scallop Free Positive Tapered Si Via Etch Using SF6-O2 Non-Bosch DRIE

1 May 2016

Improvement of LED Luminance Efficiency by Sapphire Nano PSS Etching

1 April 2016

Atomic Layer Deposition (ALD) System for Power Device Applications

11 January 2016

GaAs Wafer Plasma Scribing by ICP Etching Tool

10 October 2015

TEOS-SiO₂ Chemical Vapor Deposition for Electronic Components

18 May 2015

Optimizing the SiC Plasma Etching Process for Manufacturing Power Devices

1 April 2015

SiNx PECVD Technology without Using Explosive SiH4 Gas

10 October 2014

Plasma Dicing Solutions of a Variety of Materials

1 July 2014

RIE-800iPBC Si DRIE System for MEMS Devices Manufacturing

10 October 2013

Deposition of SiOCH Films Suitable for MEMS Manufacturing

1 July 2013

The Bosch Process Data Low-scallop Etching Process and Sidewall Smoothing Process

1 May 2013

Chlorine-Based ICP Etching for Improving the Luminance Efficiency in Nitride LEDs

10 October 2012

Plasma Dicing and Scribing Technology for GaAs Based Devices

1 July 2012

RIE-400iPB System High-Speed, Deep Silicon Etching for R&D

1 April 2012

SiO2 and SiN etching by Low Global Warming Potential Gas

10 October 2011

High-speed Etching of SiO₂ and SiC

10 October 2010

Deep Etching of Compound Semiconductors (GaAs)