Plasma Enhanced CVD System PD-2201LC
Space-saving production system

Description

The PD-2201LC is a cassette loading plasma-enhanced chemical vapor deposition (PECVD) system capable of depositing silicon-based films (silicon oxide, silicon nitride, silicon oxynitride and amorphous silicon).
This system offers all of the standard features for PECVD in a space-saving footprint. Films with superior thickness uniformity and stress control can be deposited over a 220 mm diameter area with excellent stability and repeatability. User-friendly touch screen interface for parameter control and recipe storage. This system is ideal for depositing thin films for mass production with excellent repeatability.

Key Features and Benefits

  • Processing up to ø220 mm (ø3" x 5, ø4" x 3, ø8" x 1)
  • Superior uniformity and stress control
  • Excellent process stability and repeatability
  • Robust system with minimal running / maintenance cost
  • User-friendly touch screen interface for parameter control and recipe storage.
  • With its sleek, space-saving design, the PD-2201LC requires minimal cleanroom space
  • Dual-frequency (13.56 MHz + 400 kHz) PECVD for superior process control

Applications

  • SiH4-SiNx
  • SiH4-SiO2
  • Liquid precursor (SN-2) SiNx
  • TEOS-SiO2