We specialize in the manufacture and sale of semiconductor production equipment across three primary business segments.
We develop and provide deposition systems for thin-film formation, etching systems for advanced microprocessing, and surface treatment systems for surface cleaning and modification. Instead of silicon semiconductors, our systems are tailored for compound semiconductors and various electronic devices.
Deposition
CVD Systems
This equipment utilizes reactive gases to deposit thin films onto substrates, playing a pivotal role in the fabrication of semiconductor layers, insulating films, and metallic interconnects for advanced semiconductor and electronic component manufacturing.
We specialize in Liquid Source CVD systems that utilize liquid precursors rather than flammable gases, enabling high-rate, uniform film deposition at relatively low reaction temperatures.
Liquid Source CVD Systems for TSV Applications
Formation of insulating films on the inner walls of through-holes during the through-silicon via (TSV) creation process. This technology enables the deposition of insulating films with exceptional coverage on both the sidewalls and bottoms of high-aspect-ratio through-holes.
Products
Etching
Dry Etching Systems
Our dry etching systems enable high-precision processing of semiconductor thin films, insulating layers, and other micro-structured materials across various substrates by utilizing plasma decomposition of reactive gases to achieve targeted material removal.
Etching systems utilizing Inductively Coupled Plasma (ICP) technology enable high-speed processing with exceptional uniformity.
Tornado ICP®
Tornado ICP is a proprietary inductively coupled plasma source developed through Samco's extensive expertise in plasma technology. Its unique tornado-shaped coil electrode enables the advanced etching capabilities essential for next-generation processing.
Products
Surface Treatment
Surface Treatment Systems
Our extensive portfolio ranges from compact batch-type systems to full-scale production equipment, backed by a proven track record of global installations.
Leveraging technical expertise accumulated through an extensive range of demonstration process experiments, we deliver optimized process solutions.
Plasma Processing of Plastic Substrates
Plasma treatment activates the surface to enhance die attach performance. Furthermore, it increases wire bond strength and improves adhesive bonding for encapsulation.
