Samco
Plasma Cleaners
Samco’s Plasma Cleaners utilize controlled, low-temperature gas discharge plasma to achieve thorough surface cleaning, organic residue removal, and surface energy alteration across electronic components, compound semiconductors, and optical devices. Operating with oxygen (O2), argon (Ar), or mixed gas configurations, these systems break down molecular-level organic contaminants and tailor substrate surface chemistry without altering bulk material properties. Designed to support both fundamental research and industrial manufacturing lines, Samco Plasma Cleaners ensure consistent process repeatability for packaging and device fabrication workflows.
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Plasma Cleaner PC-2000
Handles A3 size and larger
Features of Plasma Cleaners
Samco’s Batch Plasma Cleaners integrate multi-gas processing capabilities, flexible electrode configurations, and streamlined system architectures to resolve critical interface defects in semiconductor assembly and surface treatment. Utilizing reactive oxygen (O2) plasma, the systems chemically volatilize organic scum, photoresist residues, and microscopic contaminants prior to thin-film deposition, wire bonding, or mold encapsulation.
To protect delicate circuit features and prevent die attach voiding, pre-treatment on lead frames, BGA, and CSP substrates removes atomic-level organic barrier films, lowering electrical contact resistance and increasing wire bond pull-strength. System operation is further optimized through a shelf electrode architecture; operators can physically invert individual shelf tiers and adjust terminal plug configurations to rapidly switch between Plasma Etching mode (radical chemistry) and RIE mode (reactive ion etching and physical sputtering). Built with a simplified, low-footprint mechanical layout, these platforms minimize maintenance overhead while delivering continuous, highly repeatable dry processing from laboratory R&D to high-mix production lines.
