Si DRIE System RIE-800BCT
Atmospheric cassette loading
Description
The RIE-800BCT employs the Bosch process for Deep Reactive Ion Etching (DRIE) of silicon, enabling the fabrication of high aspect ratio structures with precise dimensional control. The system delivers high etch rates, smooth sidewalls, minimal tilt, and excellent selectivity, meeting the stringent requirements of MEMS, TSV, and advanced packaging applications. The atmospheric transfer module supports a dual-cassette configuration and incorporates a high-precision aligner for automatic wafer orientation, including flat and notch alignment. An optional automated edge protection ring is available to enhance process stability during high-volume manufacturing. The RIE-800BCT is capable of processing wafers up to ø200 mm (8 inches).
Key Features and Benefits
- High etch rate
- High aspect ratio etch
- High selectivity to photoresist (PR) and oxides
- Control of scalloping / Scallop-less non-bosch process
- Smooth sidewalls
- Excellent uniformity with tilt control
- Bias pulsing for notch control at silicon on insulator (SOI) wafers
- Extended process library
Applications
- Manufacture of MEMS (acceleration sensors, gyroscopes, pressure sensors, actuators, etc.)
- Processing of the inkjet printer head
- Formation of Through Silicon Via (TSV)
- Fabrication of power devices (super-junction MOSFETs)
- Plasma dicing
