Cassette Loading RIE Plasma Etching System RIE-200C
High throughput system
Description
The RIE-200C is a cassette type system for mass production, developed based on our experience with the CCP RIE system "RIE-10NR", which has an abundant delivery record. This system is capable of high-precision etching and ashing of various silicon thin films such as Si, Poly-Si, SiO₂, SiN, etc. It achieves high throughput by employing a two-cassette, double-arm robot, fully automatic operation by PLC control, and high performance to store process parameters.
Key Features and Benefits
Atmospheric high speed transfer system
This system is equipped with an atmospheric cassette chamber and an atmospheric transfer robot instead of the usual load lock chamber. It can handle automatic processing of up to ø8" wafers and can be installed in two cassettes.
Fully automatic operation
Operation is fully automated with a touch panel, and process management and data logging are possible with PLC control.
Applications
- High-precision etching of various silicon thin films such as Si, Poly-Si, SiO₂, SiN, etc.
- Photoresist ashing, stripping, and descuming
- Removal of organic contaminants
