ProductsCCP-RIE System RIE-300NR

The RIE-300NR is a reactive ion etching system designed for processing ø300 mm wafers and multiple wafer configurations with excellent uniformity (ø3" × 12, ø4" × 8, etc.). The system is engineered to minimize factory footprint, enhance throughput, maximize uptime, and reduce cost of ownership through reliable hardware and simplified maintenance.

• Flexible Processing: Handles single 300 mm wafers or batched smaller wafers.
• Excellent Uniformity: 4-way exhaust design ensures symmetrical gas flow.
• Compact Footprint: Space-saving architecture minimizes floor space.
• Advanced Safety: Hardware interlocks and real-time anomaly detection.
• Easy Automation: Intuitive touchscreen for full automation and recipe management.

• Removal of interlayer films for ø300 mm failure analysis
• Etching of Si, SiO₂, SiN, and poly-Si
• Resin etching and desmear processes
• Photoresist ashing, stripping, and descumming
• Surface modification (wettability and adhesion improvement)