ProductsCCP-RIE System RIE-200NL

The RIE-200NL is a load lock reactive ion etching (RIE) system engineered to deliver high process repeatability across diverse gas chemistries. By physically isolating the process chamber from the ambient room environment during substrate load/unload cycles, the system prevents atmospheric oxygen and moisture ingress. This structural isolation ensures baseline pressure stability, extends maintenance intervals, and minimizes moisture-induced chemical reactions inside the chamber.

• Supports single-wafer processing for up to 8-inch (200 mm) substrates, as well as simultaneous batch processing of small-diameter wafers using carrier trays.
• Symmetrical 4-way exhaust design delivering excellent uniformity via balanced gas flow
• Compatible with chlorine-based and CH4/H2 chemistries, delivering high process reproducibility
• Fully automated operation via touchscreen interface, equipped with PLC for process management and data logging
• Safe operation ensured by continuous fault detection and comprehensive interlocks

• III-V & Compound Semiconductors: GaN, GaAs, InP mesa, gate, and isolation etching
• Dielectric & Metal Patterning: Fine-line patterning of oxides, nitrides, and thin-metal films
• Pilot-Line & R&D Fabrication: University cleanrooms, national laboratories, and commercial foundry lines requiring flexible substrate loading options