ProductsCCP-RIE System RIE-200C

The RIE-200C is an atmospheric cassette loading reactive ion etching system for mass production, developed based on our experience with the RIE system "RIE-10NR". This system is capable of high-precision etching and ashing of various silicon thin films such as Si, Poly-Si, SiO2, SiN, etc. The RIE-200C achieves high throughput by employing a double-arm robot, double cassettes, fully automatic operation by PLC control, and optimization of process parameters.

• Single & Tray-Based Batch Processing: Direct handling of single wafers up to ø8 inches, alongside multi-wafer tray transfer for smaller substrates to optimize production flexibility.
• Symmetrical 4-Way Exhaust System: Four-port exhaust configuration ensures uniform gas flow distribution, reducing across-wafer non-uniformity (WIWNU).
• Space-Saving Load-Lockless Design: Elimination of the dedicated load-lock chamber reduces overall system dimensions, minimizing cleanroom footprint while maintaining fast cycle times.
• High-Speed Atmospheric Dual-Arm Transfer: Equipped with a dual-cassette interface and a high-speed dual-arm atmospheric robot to minimize handling overhead and increase total tool throughput (WPH).
• Comprehensive Safety & Hardware Interlocks: Integrated hardware/software interlocks and continuous anomaly detection guard against process deviations and operator hazards.

• Etching of various materials such as Si, SiO2, SiN, Poly-Si, etc.
• Photoresist ashing, stripping, and descuming
• Removal of organic contaminants