ProductsSi DRIE System RIE-800iPBC

The RIE-800iPBC is a high-performance Silicon Deep Reactive Ion Etching (Si DRIE) system engineered for high-volume manufacturing (HVM) in MEMS, TSV, and advanced packaging applications. Building upon the proven etch performance of the RIE-800iPB, the RIE-800iPBC integrates an automated Cassette-to-Cassette transfer system, enabling continuous single-wafer processing for substrates up to ø8 inches without compromising vacuum integrity or introducing ambient contamination.

• Dedicated Bosch process ICP coil enables efficient application of up to 5,000 W RF power
• High-speed gas switching (0.1 s) achieves low-scallop sidewall processing
• High silicon-to-photoresist selectivity of over 500:1
• High silicon etch rates exceeding 45 μm/min
• Capable of high-aspect-ratio etching exceeding 100:1
• Suppresses tilt to ensure high process uniformity across ø8-inch wafers
• Supports parameter ramping for optimized process control
• Enables non-Bosch processing for scallop-free etching and tapered sidewall control
• Extensive process library available

• MEMS device fabrication (accelerometers, gyroscopes, pressure sensors, actuators, etc.)
• Deep silicon etching for TSVs and 3D integration
• Microfluidic device fabrication (microchannels, μTAS, etc.)
• Quartz (SiO2) microfabrication for optical components and fluidic substrates
• R&D applications in photonics and advanced microstructures