ProductsSi DRIE System RIE-800BCT

The RIE-800BCT is a Silicon Deep Reactive Ion Etching (DRIE) system engineered to deliver high etch rates and high aspect ratios for volume manufacturing in MEMS, TSV, and 3D IC packaging. Equipped with an advanced atmospheric transfer module and a vacuum load lock, the system processes single wafers up to ø8 inches with superior process repeatability and minimal particulate generation.

• Dedicated Bosch process ICP coil enables efficient application of up to 5,000 W RF power
• High-speed gas switching (0.1 s) achieves low-scallop sidewall processing
• High silicon-to-photoresist selectivity of over 500:1
• High silicon etch rates exceeding 45 μm/min
• Capable of high-aspect-ratio etching exceeding 100:1
• Suppresses tilt to ensure high process uniformity across ø8-inch wafers
• Supports parameter ramping for optimized process control
• Enables non-Bosch processing for scallop-free etching and tapered sidewall control
• Extensive process library available

• MEMS device fabrication (accelerometers, gyroscopes, pressure sensors, actuators, etc.)
• Deep silicon etching for TSVs and 3D integration
• Microfluidic device fabrication (microchannels, μTAS, etc.)
• Quartz (SiO2) microfabrication for optical components and fluidic substrates
• R&D applications in photonics and advanced microstructures

• MEMS device fabrication (accelerometers, gyroscopes, pressure sensors, actuators, etc.)
• Deep silicon etching for TSVs and 3D integration
• Microfluidic device fabrication (microchannels, μTAS, etc.)
• Quartz (SiO2) microfabrication for optical components and fluidic substrates
• R&D applications in photonics and advanced microstructures