ProductsSi DRIE System RIE-800iPB

The RIE-800iPB Si DRIE System supports the Bosch process to deliver high-rate, high-aspect-ratio silicon etching required for MEMS and TSV applications. It also accommodates non-Bosch processes for flexible sidewall profile control. Equipped with a load lock chamber, the system provides single-wafer processing for substrates up to ø8 inches with high process repeatability.

• Dedicated Bosch process ICP coil enables efficient application of up to 5,000 W RF power
• High-speed gas switching (0.1 s) achieves low-scallop sidewall processing
• High silicon-to-photoresist selectivity of over 500:1
• High silicon etch rates exceeding 45 μm/min
• Capable of high-aspect-ratio etching exceeding 100:1
• Suppresses tilt to ensure high process uniformity across ø8-inch wafers
• Supports parameter ramping for optimized process control
• Enables non-Bosch processing for scallop-free etching and tapered sidewall control
• Extensive process library available

• MEMS device fabrication (accelerometers, gyroscopes, pressure sensors, actuators, etc.)
• Deep silicon etching for TSVs and 3D integration
• Microfluidic device fabrication (microchannels, μTAS, etc.)
• Quartz (SiO2) microfabrication for optical components and fluidic substrates
• R&D applications in photonics and advanced microstructures