Si DRIE System RIE-400iPB
Precision Deep Etching for Si and SiO2
Description
The Samco RIE-400iPB is a high-speed silicon deep etching system powered by an Inductively Coupled Plasma (ICP) source. Supporting both Bosch and non-Bosch processes, it delivers high-aspect-ratio silicon etching for MEMS and TSVs alongside precise sidewall profile control. Its load-lock chamber supports single-wafer processing for substrates up to 4 inches in diameter, ensuring excellent process repeatability. Built for a wide range of applications—including MEMS, microfluidics, and optical components—the system can also be configured with a specialized ICP source for high-rate SiO2 etching.
Key Features and Benefits
- Efficient RF power coupling via Bosch-dedicated ICP coil
- High-aspect-ratio silicon etching (>30:1)
- Low-scallop sidewalls via rapid gas switching
- Scallop-free processing with non-Bosch capability
- Precise positive-taper sidewall profile control
- Extensive process library
- High-rate SiO2 etching via swappable ICP source (Optional)
Applications
- MEMS device fabrication (accelerometers, gyroscopes, pressure sensors, actuators, etc.)
- Deep silicon etching for TSVs and 3D integration
- Microfluidic device fabrication (microchannels, μTAS, etc.)
- Quartz (SiO2) microfabrication for optical components and fluidic substrates
- R&D applications in photonics and advanced microstructures
Options
- SiO₂ ICP Source Unit
Papers & Publications
- Hada, Miyako, et al. "Chamber in-situ estimation during etching process by SiF4 monitoring using laser absorption spectroscopy." Japanese Journal of Applied Physics 62.SI (2023): SI1013.
- Sensitivity of Piezoelectric Ultrasonic Microsensors with Sol-Gel Derived PZT Films Prepared through Various Pyrolysis Temperatures
- Eswaramoorthy, Lekshmi, et al. "Focused ion beam polishing based optimization of high-Q silica microdisk resonators." Physica Scripta 101.4 (2026): 045513.
- Zhou, Xiaoqi, et al. "Spectrum-tailorable two-dimensional silicon–titanium nitride selective emitter by photon recycling for thermophotovoltaic applications." Solar Energy Materials and Solar Cells 286 (2025): 113560.
- Numerical and Experimental Analyses of Three-Dimensional Unsteady Flow around a Micro-Pillar Subjected to Rotational Vibration
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