SEMICON Japan 2026

Date
December 9-11, 2026
Location
Tokyo Big Sight
Contents

SEMICON Japan 2026 is a leading semiconductor industry exhibition in Japan, bringing together device makers, materials suppliers, equipment manufacturers, and R&D organizations across the semiconductor and advanced packaging ecosystem.

At this event, Samco Inc. will focus on practical process solutions for precision plasma etching and plasma-enhanced thin film deposition to support next-generation device development and manufacturing challenges such as scaling, new material integration, and damage control.

Key highlights for visitors

  • Process consultation for compound semiconductors (GaN/GaAs/InP), Si/SiC, glass/quartz, dielectrics, and metals

  • Atomic-scale process control concepts for ultra-fine patterning and low-damage etching

  • R&D-to-production scalability: compact platforms and process transfer considerations

  • Application discussions for power devices, photonics, RF devices, MEMS, and advanced materials

Products

  • Atomic Layer Etching (ALE) systems
    Nano-level etch depth control by separating adsorption and reaction steps, suitable for low-damage, high-precision etching requirements.

  • Inductively Coupled Plasma (ICP) etching systems
    High-density plasma etching for a wide range of materials, including III-V compound semiconductors, supporting both research and production needs.

  • Silicon Deep Reactive Ion Etching (DRIE) systems
    Deep silicon etching solutions optimized for MEMS structures and TSV-related processes where profile control and repeatability are critical.

  • Reactive Ion Etching (RIE) / plasma etching systems
    Versatile plasma etching platforms for material development and device prototyping across diverse substrates and films.

  • Plasma Enhanced CVD (PECVD) systems
    Plasma-assisted thin film deposition for device and materials R&D, supporting process development for dielectric and functional thin films.

Link