SEMICON Europa 2026

Date
November 10-13, 2026
Location
Messe München, Munich, Germany
Contents

Overview
SEMICON Europa 2026 is a leading international exhibition for semiconductor manufacturing technologies, bringing together equipment, materials, and process innovations across semiconductors, MEMS, and advanced materials.

Samco Inc.’s focus at this event
At SEMICON Europa 2026, Samco Inc. will showcase advanced plasma-based etching and deposition technologies for semiconductor and MEMS R&D as well as pilot production. The exhibit will highlight Samco Inc.’s capabilities in atomic-level process control, high-aspect-ratio etching, and flexible R&D-oriented system design.

Key highlights for visitors

  • Atomic-layer process technologies including Atomic Layer Etching (ALE) and Atomic Layer Deposition (ALD)
  • Deep silicon etching solutions such as DRIE for MEMS structures and TSV applications
  • ICP etching and PECVD technologies for compound semiconductors and functional materials
  • Process solutions optimized for R&D, prototyping, and small-scale production
  • Technical consultations with Samco Inc. specialists on process development and system configuration
Products
  • Atomic Layer Etching (ALE) Systems
    Highly controlled, layer-by-layer etching processes for advanced node semiconductor devices and nanofabrication research.
  • Atomic Layer Deposition (ALD) Systems
    Conformal thin-film deposition technology enabling precise thickness control for advanced semiconductor, MEMS, and functional material applications.
  • ICP Etching Systems
    Inductively Coupled Plasma etching equipment offering high etch rates, excellent uniformity, and broad process flexibility for semiconductor and MEMS fabrication.
  • DRIE (Deep Reactive Ion Etching) Systems
    High-aspect-ratio silicon etching solutions optimized for MEMS structures, through-silicon vias (TSVs), and advanced microfabrication.
  • PECVD Systems
    Plasma Enhanced Chemical Vapor Deposition systems for low-temperature thin-film formation used in semiconductor and materials processing.