Samco focuses on product development with an emphasis on environment, health and safety (EHS). We have been advancing research on water vapor plasma at low pressure, Aqua Plasma ^[1], and product development using this treatment method. H, O, and OH radicals are generated in the plasma, and reduce oxidized copper or silver electrodes, remove organic residue, and make  the surface superhydrophilic. This method is widely used in semiconductor back-end processes such as wire bonding and molding on lead frames. Its applications have included reduction of electrodes, cleaning of organic residues, and hydrophilization to improve wettability or adhesion. Nowadays, the Aqua Plasma  has expanded to front-end processes such as descum process to remove photoresist residue on the copper electrode prior to plating. Moreover, the range of applications has expanded to include ø12" wafers. However, it had an upper size limit for reducible oxidized copper. This report introduces Aqua Plasma Boost newly developed to reduce large sized samples of oxidized copper and the system AQ-2000BT.

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