High-Precision Etching
Co-Packaged Optics (CPO) technology relies on high-density InP-based photonic integration to deliver low-power, high-speed optical connectivity for data transmission. Fabricating optical waveguides and laser ridges within these modules requires extreme profile control to prevent signal attenuation and mode distortion.Samco's proprietary ICP etching technology achieves superior anisotropy and sidewall cleanliness in InP dry processing. By optimizing process gas chemistry and plasma density, we achieve a high-aspect-ratio ridge profile (1.8 µm width, 2.5 µm depth) with minimal footing. The process achieves a high etch rate of 350 nm/min using a SiO2 hard mask while leaving virtually no redeposition on the sidewalls.This process directly addresses the rigorous manufacturing requirements of CPO components, enabling scalable production of high-performance photonic integrated circuits (PICs) from Lab and Fab.
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