CIOE 2026

Date
September 9-11, 2026
Location
Shenzhen World Exhibition & Convention Center, Shenzhen, China
Booth
10D709, Hall 10
Products
  • InP Laser Etching Systems – Dry etching solutions specifically designed for InP-based laser devices used in optical communications and photonic integrated circuits (PICs). These systems support precise control of laser facets, ridge waveguides, and complex compound semiconductor structures.
  • InP Laser Deposition Systems – Thin-film deposition technologies optimized for InP laser fabrication, enabling high-quality dielectric and passivation layers essential for device reliability and optical performance.
  • Atomic Layer Etching (ALE) Systems – Atomic-scale etching technology providing exceptional precision for critical layers in photonic devices, including quantum well structures and nanoscale optical components.
  • ALD (Atomic Layer Deposition) Systems – Conformal and thickness-controlled film deposition for advanced photonic and optoelectronic devices, supporting surface passivation, optical confinement layers, and emerging InP-based device architectures.
  • ICP (Inductively Coupled Plasma) Etching Systems – High-uniformity plasma etching suitable for compound semiconductors and photonic structures, widely applied to waveguides, gratings, and laser-related microstructures.
  • DRIE (Deep Reactive Ion Etching) Systems – High-aspect-ratio etching technology for silicon and related materials, enabling photonic integration, MEMS-based optical components, and advanced packaging solutions.
  • R&D-Oriented Process Equipment – Modular and flexible process platforms designed for photonics R&D, prototyping, and pilot production, supporting rapid development of next-generation laser and optoelectronic devices.
Link

Official exhibition website: https://www.cioe.cn/en/