The 73rd Spring Meeting of the Japan Society of Applied Physics (JSAP)

Date
March 15, 2026 (Sun) – March 18, 2026 (Wed)
Location
Ookayama Campus, Institute of Science Tokyo Tokyo, Japan
Contents

The 73rd Spring Meeting of the Japan Society of Applied Physics (JSAP) is one of Japan’s leading academic conferences covering applied physics, materials science, and related technologies. The accompanying exhibition brings together equipment manufacturers, technology providers, and research organizations to present the latest tools and solutions supporting advanced research and development.
At this exhibition, Samco Inc. will introduce its dry process technologies and R&D-oriented equipment designed to support cutting-edge research in semiconductor devices, MEMS, and advanced materials.

Products
  • ICP Dry Etching Systems
    Inductively coupled plasma etching systems offering high plasma density and excellent process controllability for semiconductor and MEMS applications.
  • Atomic Layer Etching (ALE) Technologies
    Damage-minimized, atomic-scale etching processes suitable for next-generation device fabrication and materials research.
  • Plasma-Enhanced CVD (PECVD) Systems
    Thin-film deposition solutions for dielectric and functional films at low temperatures.
  • R&D-Oriented Process Equipment
    Flexible, compact systems designed for universities and research laboratories, supporting process development and exploratory studies.
Link

Official exhibition website: https://meeting.jsap.or.jp/exhibition
Samco Inc. product information: https://www.samcointl.com/products/