ProductsALD System AD-8002LPC

The Samco AD-8002LPC is an advanced Atomic Layer Deposition (ALD) platform engineered with two independent process chambers based on Samco’s field-proven AD-800LP architecture. Featuring an integrated vacuum cassette chamber, the system bridges the gap between high-flexibility process development and production-level efficiency. By processing substrates simultaneously or running distinct process recipes in parallel, the AD-8002LPC optimizes cassette takt times while offering strict cross-contamination control for multi-material device fabrication.

• Dual Independent Process Chambers: Configured with two parallel reactors based on the AD-800LP architecture, effectively doubling wafer processing capacity or allowing independent process runs to maximize system utilization.
• Cross-Contamination-Free Multi-Layer Stacking: Enables sequential deposition of distinct dielectric layers (such as oxides and nitrides) across separate chambers without ambient exposure or precursor cross-mixing.
• Automated Vacuum Cassette Loading: Cassette-to-cassette vacuum transfer handles substrates up to Ø220 mm (or piece-sample carriers), isolating delicate substrate interfaces from atmospheric oxygen and moisture prior to deposition.

• InP Laser Facet Passivation & Optical Coating: Delivers ultra-low-damage dielectric films (Al₂O₃, AlN) on Indium Phosphide (InP) optical amplifier and laser cavity facets to eliminate surface recombination centers, prevent Catastrophic Optical Damage (COD), and achieve precise reflectivity control for high-power photonic integrated circuits (PICs).
• GaN & SiC Power Device Passivation: Deposits defect-free, high-κ gate dielectrics (Al₂O₃, HfO₂) and field passivation layers to reduce interface state density (D_it) and suppress current collapse in high-voltage compound semiconductor devices.
• High-Aspect-Ratio 3D MEMS Coating: Provides 100% conformal step coverage inside deep trenches, micro-channels, and complex 3D topologies with aspect ratios exceeding 50:1 using self-limiting surface reaction cycles.
• Encapsulation for 2D Materials & Nanotubes: Utilizes low-temperature remote radical exposure to coat carbon nanotubes (CNTs), graphene, and 2D materials without damaging underlying atomic lattices or degrading carrier mobility.
• Multi-Layer Environmental Barrier Coatings: Enables automated sequential growth of dense oxide/nitride nanolaminates to eliminate pinhole propagation pathways for thin-film encapsulation (TFE) with ultra-low moisture transmission.