Aqua Plasma® Cleaner AQ-500
All-in-one space-saving footprint
Description
The Aqua Plasma® Cleaner AQ-500 is a water vapor (H₂O)-based plasma cleaning system for environmentally friendly surface treatment. It supports metal oxide reduction, organic contaminant removal, bonding pretreatment, and super-hydrophilization. With a compact design featuring an integrated dry pump and recipe management functions, it is suitable for applications from research to production.
Key Features and Benefits
- Reduction rate over 2x faster than hydrogen plasma
- Ashing rate over 4x faster than hydrogen plasma
- Makes hydrophobic resins ultra-hydrophilic (excluding fluoropolymers)
- Ideal pre-treatment for resin, wafer, and metal bonding
- Oxygen and argon plasma can also be used (optional)
- All-in-one space-saving footprint (540 mm (W) x 650 mm (D))
- One-touch startup for the water vapor generation unit
Applications
- Surface reduction, modification, and cleaning of silver (Ag) electrodes
- Surface reduction, modification, and cleaning of copper (Cu) electrodes
- Adhesive-free bonding of resins, glass, and wafers for microfluidic chip applications
- Surface modification and ultra-hydrophilization of resins
Papers & Publications
- Takakuwa, Masahito, et al. "Direct gold bonding for flexible integrated electronics." Science Advances 7.52 (2021): eabl6228.
- Takamatsu, Seiichi, et al. "Flexible no-drift data glove using ultrathin silicon for the metaverse." Device 3.5 (2025).
- Liu, Hao, et al. "Ultrathin bending sensor with ultrahigh robustness and reliability for robotic applications." npj Flexible Electronics 9.1 (2025): 123.
Related Products
Explore more products in Aqua Plasma® Cleaners
