CCP-RIE System RIE-10NR
Standard CCP-RIE Etching System with Proven Track Record
Description
The Samco RIE-10NR is a fully automatic, open-load Reactive Ion Etching (RIE) system engineered for non-corrosive gas chemistry applications. Designed with an active installed base of over 700 units, the system features a reaction chamber with a proprietary gas distribution mechanism and a four-way symmetrical exhaust configuration, delivering superior etch uniformity and run-to-run repeatability across diverse material platforms.
Key Features and Benefits
- Single-wafer processing up to ø8-inch (ø200 mm) wafers and high-throughput batch processing for small-diameter wafers
- Four-way exhaust system establishes a symmetrical gas flow for superior film uniformity
- Space-saving architecture delivers a compact cleanroom footprint
- Comprehensive interlocks and fault detection systems ensure safe system operation
- Touch-panel interface enables automated operation and recipe management (up to 100 recipes, 10 steps each)
Applications
- Selective etching of SiO2 and SiN for failure analysis
- SiO2 hard mask etching for compound semiconductor devices
- Silicon (Si) etching
- Metal patterning (e.g., Pt, Mo) for sensor fabrication
- Etching of organic materials and resins
- Descumming and photoresist ashing
Options
- Stainless steel (SUS) chamber liner
- Adjustable electrode gap configuration
- Optical emission spectroscopy (OES) endpoint monitor
- Anode/cathode switching function
