Plasma Cleaner PC-2000
Parallel-Plate Batch Plasma Cleaner with Over 500 Installations
Description
This parallel-plate batch plasma cleaner features an installed base of over 500 units. It is designed for cleaning, ashing, and surface modification (hydrophilization) of semiconductor packaging substrates, wafers, optical components, and bio-healthcare devices.
The system supports both Plasma Etching (PE) and Reactive Ion Etching (RIE) modes, allowing process optimization for specific substrate materials and application goals. The reaction chamber accommodates multi-tier electrode shelves, enabling high-throughput batch processing for diverse workpieces—from small components up to 400 mm × 400 mm large-area substrates. Equipped with comprehensive recipe and user management features, it scales seamlessly from R&D to full production.
Key Features and Benefits
- Selectable processing modes (PE and RIE) ensure optimal processing tailored to specific substrate materials.
- Easily switch between processing modes by simply swapping the electrode shelves.
- Removable shielding plates and O-ring seals simplify cleaning and routine maintenance.
- RF power output up to 900 W enhances overall productivity.
- A 10.4-inch color touch panel provides intuitive system operation.
- Includes real-time monitoring for Vdc, Vpp, and matching box position, alongside an integrated event log.
- Integrated internal dry pump minimizes tool footprint to save cleanroom space.
Applications
- Cleaning and surface modification of leadframes and plastic packages (e.g., BGA, CSP)
- Hydrophilization of optical components and precision molds
- Photoresist ashing
- Mold recycling via DLC (Diamond-Like Carbon) film removal
- Surface modification and hydrophilization of microfluidic channels, cell culture dishes, and bio-devices
Options
- Expandable electrode shelves (up to 3-tier processing)
- Data logging system with PC
- Slow-pumpdown and slow-vent valves
