Aqua Plasma® Cleaner AQ-2000
Advanced Surface Treatment Using Water Vapor for Reduction & Bonding
Description
The Aqua Plasma® Cleaner AQ-2000 is a water vapor (H₂O)-based plasma cleaning
system for environmentally friendly surface treatment. It supports metal oxide reduction,
organic contaminant removal, bonding pretreatment, and super-hydrophilization.
With a compact design featuring an integrated dry pump and recipe management functions,
it is suitable for applications from research to production.
Key Features and Benefits
- Reduction rate over 2x faster than hydrogen plasma
- Ashing rate over 4x faster than hydrogen plasma
- Makes hydrophobic resins ultra-hydrophilic (excluding fluoropolymers)
- Ideal pre-treatment for resin, wafer, and metal bonding
- Oxygen and argon plasma can also be used (optional)
- All-in-one space-saving footprint (762 mm (W) x 1135 mm (D))
- One-touch startup for the water vapor generation unit
- Supports multi-tier processing up to 3 levels
Applications
- Surface reduction, modification, and cleaning of silver (Ag) electrodes
- Surface reduction, modification, and cleaning of copper (Cu) electrodes
- Adhesive-free bonding of resins, glass, and wafers for microfluidic chip applications
- Surface modification and ultra-hydrophilization of resins
Options
- Pirani vacuum gauge unit for zero-point adjustment (for maintenance)
- Quartz cover for electrodes (to prevent sputtering on the powered electrode)
