Non-bosch process scallop-less DRIE
Nano-level Si DRIE with line & space = 150/50 nm is achieved by the non-bosch process. Samco' unique solution provides precise Si DRIE with an aspect ratio of 5:1. In principle, sidewall scallops can be a problem in the bosch process Si DRIE. However, sidewall scallops do not occur in non-bosch process DRIE.