Application

SAW Device

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Manufacturing Process

壓電基板

SAW Devices

沉積電極膜

SAW Devices

曝光/顯影

SAW Devices

乾式蝕刻

RIE-200LC

RIE-200iPC

形成電極

SAW Devices

電漿洗淨

PC-1100

清除光罩

SAW Devices

乾式蝕刻

RIE-200iPC

磨平 (1)

蝕刻基板

SAW Devices

電漿CVD

PD-220LC

磨平 (2)

在全體表面沉積薄膜

SAW Devices

電漿CVD

PD-220LC

形成絕緣層

SAW Devices

乾式蝕刻

RIE-200iPC

鑽孔

蝕刻絕元層並露出電極

SAW Devices

切割

SAW Devices

電漿洗淨

PC-1100

封裝

於切割及打線後洗淨

SAW Devices

表面聲波過濾器

SAW Devices

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