UV Ozone Cleaner UV-300H
High ashing rates of 200 - 300 nm/min
Description
The UV-300H is a high performance and compact UV ozone cleaner. Substrates are loaded into the system through a sliding drawer. This system uses a unique combination of ultraviolet irradiation, high concentration of ozone, and stage heating to gently, yet effectively, remove organic materials from a variety of substrates, including silicon, glass, compound semiconductors (GaN, SiC, GaAs, and InP), sapphire, ceramics, etc.
Key Features and Benefits
- Processing up to ø300 mm (ø12 inch）
- High ashing rates of 200 - 300 nm/min
- Heating stage accelerates the cleaning rates and realizes a broad process temperature range
- Gap adjustment between the stage and the quartz diffusion plate enables uniformity improvement over the substrate
- Compact, uses minimum cleanroom space
- Easy, operates at atmospheric pressure - no vacuum system required
- Soft, completely dry process will not cause electrical damage to substrates
- Drawer interlock guarantees system is inoperable when the drawer is open
- Built-in ozone catalyst unit for reducing ozone concentration in the exhaust to a safe level
Applications
- Surface cleaning of plastic packages and lead-frames
- Surface cleaning of compound semiconductor (GaN, SiC, GaAs, and InP)
- Surface modification (wettability and adhesion improvement)
- Surface oxidation (thin oxidized layer deposition)
- Photoresist ashing, stripping, and descuming
- Removal of organic contaminants
- UV curing
